Thermal conductivity and thermal boundary resistance of nanostructures

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Tytuł:: Thermal conductivity and thermal boundary resistance of nanostructures
Autorzy:: Merabia Samy
Parasuraman Jayalakshmi
Angelescu Dan
Marty Frédéric
Bourouina Tarik
Basset Philippe
Kleber Xavier
Termentzidis Konstantinos
Da Cruz Carolina
Chantrenne Patrice
Temat:: Materials of engineering and construction. Mechanics of materials
TA401-492
Źródło:: Nanoscale Research Letters, Vol 6, Iss 1, p 288 (2011)
Wydawca:: SpringerOpen, 2011.
Rok publikacji:: 2011
Kolekcja:: LCC:Materials of engineering and construction. Mechanics of materials
Typ dokumentu:: article
Opis pliku:: electronic resource
Język:: English
ISSN:: 1931-7573
1556-276X
Relacje:: http://www.nanoscalereslett.com/content/6/1/288; https://doaj.org/toc/1931-7573; https://doaj.org/toc/1556-276X
Dostęp URL:: https://doaj.org/article/89dcd0a128764072956bde1f7f865fb0 Link otwiera się w nowym oknie
Numer akcesji:: edsdoj.89dcd0a128764072956bde1f7f865fb0
: Czasopismo naukowe

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Abstract We present a fabrication process of low-cost superlattices and simulations related with the heat dissipation on them. The influence of the interfacial roughness on the thermal conductivity of semiconductor/semiconductor superlattices was studied by equilibrium and non-equilibrium molecular dynamics and on the Kapitza resistance of superlattice's interfaces by equilibrium molecular dynamics. The non-equilibrium method was the tool used for the prediction of the Kapitza resistance for a binary semiconductor/metal system. Physical explanations are provided for rationalizing the simulation results. PACS 68.65.Cd, 66.70.Df, 81.16.-c, 65.80.-g, 31.12.xv

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