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Title of the item:

Implementation of a low temperature wafer bonding process for acceleration sensors

Title:
Implementation of a low temperature wafer bonding process for acceleration sensors
Authors:
Wiemer, Maik
Otto, Thomas
Gessner, ThomasAff115, Aff215
Hiller, Karla
Kapser, Konrad
Seidel, Helmut
Bagdahn, Joerg
Petzold, Matthias
Source:
MRS Online Proceedings Library. 682(1)
Academic Journal

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