- Tytuł:
-
A low-profile
electromechanical packaging system for soft-to-flexible bioelectronic interfaces. - Autorzy:
- Temat:
-
FLEXIBLE printed circuits
SEMICONDUCTORS
AUDITORY cortexELECTROMECHANICAL devices
TECHNOLOGICAL innovations
BIOELECTRONICS
ELECTROCHEMICAL cutting - Źródło:
- APL Bioengineering; Sep2023, Vol. 7 Issue 3, p1-10, 10p
Czasopismo naukowe