- Tytuł:
-
Stereolithographic Process for Embedding of
Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching. - Autorzy:
- Źródło:
-
Journal of Microelectronic &
Electronic Packaging. 2024, Vol. 21 Issue 1, p9-13. 5p.
Czasopismo naukowe