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Wyszukujesz frazę ""Electrical and Electronic Engineering"" wg kryterium: Temat

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Wyświetlanie 1-20 z 251
Tytuł:
Investigating the effects of uniaxial pressure on the preparation of MgTiO3–CaTiO3 ceramic capacitors for MRI systems
Autorzy:
Zaineb Jebri
Mahfoudh Taleb Ali
Isabelle Bord Majek
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Temat:
ceramics
electrical and electronic engineering
materials engineering
Engineering (General). Civil engineering (General)
TA1-2040
Źródło:
The Journal of Engineering, Vol 2023, Iss 9, Pp n/a-n/a (2023)
Opis pliku:
electronic resource
Relacje:
https://doaj.org/toc/2051-3305
Dostęp URL:
https://doaj.org/article/0b9fecea4b4f43abba8a1a0ccde7bf65  Link otwiera się w nowym oknie
Czasopismo naukowe
Szczegóły
Tytuł:
Removal of the rate table: MEMS gyrocompass with virtual maytagging.
Autorzy:
Miao T; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Li Q; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Chen L; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Li J; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Hu X; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Wu X; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Wu W; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
Xiao D; College of Intelligence Science and Technology, National University of Defense Technology, Changsha, 410073 China.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Nov 06; Vol. 9, pp. 138. Date of Electronic Publication: 2023 Nov 06 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Tytuł:
C-MEMS-derived glassy carbon electrochemical biosensors for rapid detection of SARS-CoV-2 spike protein.
Autorzy:
Mandal N; School of Electrical Sciences, Indian Institute of Technology Goa, 403401 Ponda, Goa India.
Mitra R; School of Chemical and Materials Sciences, Indian Institute of Technology Goa, 403401 Ponda, Goa India.
Pramanick B; School of Electrical Sciences, Indian Institute of Technology Goa, 403401 Ponda, Goa India.; Centre of Excellence in Particulates Colloids and Interfaces, Indian Institute of Technology Goa, 403401 Ponda, Goa India.; School of Interdisciplinary Life Sciences, Indian Institute of Technology Goa, 403401 Ponda, Goa India.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Nov 06; Vol. 9, pp. 137. Date of Electronic Publication: 2023 Nov 06 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Tytuł:
A novel evolutionary method for parameter-free MEMS structural design and its application in piezoresistive pressure sensors.
Autorzy:
Meng Q; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, 100049 Beijing, China.
Wang J; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, 100049 Beijing, China.
Chen D; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, 100049 Beijing, China.
Chen J; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.; School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, 100049 Beijing, China.
Xie B; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.
Lu Y; State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, 100190 Beijing, China.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Oct 25; Vol. 9, pp. 134. Date of Electronic Publication: 2023 Oct 25 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Tytuł:
Research progress of electronic nose technology in exhaled breath disease analysis.
Autorzy:
Li Y; School of Instrument Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing, 100192 China.; Laboratory of Intelligent Microsystems, Beijing Information Science and Technology University, Beijing, 100192 China.
Wei X; School of Instrument Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing, 100192 China.; Laboratory of Intelligent Microsystems, Beijing Information Science and Technology University, Beijing, 100192 China.
Zhou Y; School of Instrument Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing, 100192 China.
Wang J; School of Electronics and Information Engineering, Changchun University of Science and Technology, Changchun, 130022 China.
You R; School of Instrument Science and Opto-Electronics Engineering, Beijing Information Science and Technology University, Beijing, 100192 China.; Laboratory of Intelligent Microsystems, Beijing Information Science and Technology University, Beijing, 100192 China.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Oct 11; Vol. 9, pp. 129. Date of Electronic Publication: 2023 Oct 11 (Print Publication: 2023).
Typ publikacji:
Journal Article; Review
Czasopismo naukowe
Szczegóły
Tytuł:
An implantable, wireless, battery-free system for tactile pressure sensing.
Autorzy:
Du L; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA USA.
Hao H; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
Ding Y; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
Gabros A; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA USA.
Mier TCE; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
Van der Spiegel J; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
Lucas TH; Departments of Neurosurgery and Biomedical Engineering, Ohio State University, Columbus, OH USA.
Aflatouni F; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
Richardson AG; Department of Neurosurgery, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA USA.
Allen MG; Department of Electrical and Systems Engineering, School of Engineering and Applied Science, University of Pennsylvania, Philadelphia, PA USA.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Oct 11; Vol. 9, pp. 130. Date of Electronic Publication: 2023 Oct 11 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Tytuł:
Brainmask: an ultrasoft and moist micro-electrocorticography electrode for accurate positioning and long-lasting recordings.
Autorzy:
Ji B; Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, 710072 China.; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.; Collaborative Innovation Center of Northwestern Polytechnical University, Shanghai, 201108 China.
Sun F; Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, 710072 China.; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.; Collaborative Innovation Center of Northwestern Polytechnical University, Shanghai, 201108 China.
Guo J; Institute of Medical Research, Northwestern Polytechnical University, Xi'an, 710072 China.
Zhou Y; Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, 710072 China.; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.; Collaborative Innovation Center of Northwestern Polytechnical University, Shanghai, 201108 China.
You X; Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, 710072 China.; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.; Collaborative Innovation Center of Northwestern Polytechnical University, Shanghai, 201108 China.
Fan Y; College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018 China.
Wang L; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, 200240 China.
Xu M; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, 200240 China.
Zeng W; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.
Liu J; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, 200240 China.
Wang M; College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, 310018 China.
Hu H; Institute of Medical Research, Northwestern Polytechnical University, Xi'an, 710072 China.
Chang H; Ministry of Education Key Laboratory of Micro and Nano Systems for Aerospace, School of Mechanical Engineering, Northwestern Polytechnical University, Xi'an, 710072 China.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Oct 10; Vol. 9, pp. 126. Date of Electronic Publication: 2023 Oct 10 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Tytuł:
Muscle-inspired soft robots based on bilateral dielectric elastomer actuators.
Autorzy:
Yang Y; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu, PR China.; Chongqing Key Laboratory of Materials Surface & Interface Science, Chongqing Co-Innovation Center for Micro/Nano Optoelectronic Materials and Devices, Micro/Nano Optoelectronic Materials and Devices International Science and Technology Cooperation Base of China, School of Materials Science and Engineering, Chongqing University of Arts and Sciences, Chongqing, PR China.
Li D; Hong Kong Centre for Cerebro-Cardiovascular Health Engineering (COCHE), Hong Kong, SAR China.
Sun Y; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu, PR China.; Chongqing Key Laboratory of Materials Surface & Interface Science, Chongqing Co-Innovation Center for Micro/Nano Optoelectronic Materials and Devices, Micro/Nano Optoelectronic Materials and Devices International Science and Technology Cooperation Base of China, School of Materials Science and Engineering, Chongqing University of Arts and Sciences, Chongqing, PR China.
Wu M; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu, PR China.; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, SAR China.
Su J; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, SAR China.
Li Y; Chongqing Key Laboratory of Materials Surface & Interface Science, Chongqing Co-Innovation Center for Micro/Nano Optoelectronic Materials and Devices, Micro/Nano Optoelectronic Materials and Devices International Science and Technology Cooperation Base of China, School of Materials Science and Engineering, Chongqing University of Arts and Sciences, Chongqing, PR China.
Yu X; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, SAR China.
Li L; Chongqing Key Laboratory of Materials Surface & Interface Science, Chongqing Co-Innovation Center for Micro/Nano Optoelectronic Materials and Devices, Micro/Nano Optoelectronic Materials and Devices International Science and Technology Cooperation Base of China, School of Materials Science and Engineering, Chongqing University of Arts and Sciences, Chongqing, PR China.
Yu J; State Key Laboratory of Electronic Thin Films and Integrated Devices, School of Optoelectronic Science and Engineering, University of Electronic Science and Technology of China (UESTC), Chengdu, PR China.
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Źródło:
Microsystems & nanoengineering [Microsyst Nanoeng] 2023 Oct 07; Vol. 9, pp. 124. Date of Electronic Publication: 2023 Oct 07 (Print Publication: 2023).
Typ publikacji:
Journal Article
Czasopismo naukowe
Szczegóły
Wyświetlanie 1-20 z 251

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