Generation of DNA oligomers with similar chemical kinetics via in-silico optimization.
Autorzy:
Tobiason M; Department of Computer Science, Boise State University, Boise, ID, USA. .; Micron School of Materials Science & Engineering, Boise State University, Boise, ID, USA. . Yurke B; Micron School of Materials Science & Engineering, Boise State University, Boise, ID, USA.; Department of Electrical & Computer Engineering, Boise State University, Boise, ID, USA. HughesWL; School of Engineering, University of British Columbia Okanagan Campus, Kelowna, BC, Canada. will.hughes@ubc.ca.
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Źródło:
Communications chemistry [Commun Chem] 2023 Oct 18; Vol. 6 (1), pp. 226. Date of Electronic Publication: 2023 Oct 18.
In-vitro validated methods for encoding digital data in deoxyribonucleic acid (DNA).
Autorzy:
Mortuza GM; Department of Computer Science, Boise State University, Boise, Idaho, USA. Guerrero J; Department of Nanoengineering, Joint School of Nanoscience and Nanoengineering, North Carolina A&T State University, Greensboro, NC, USA. Llewellyn S; Department of Computer Science, Boise State University, Boise, Idaho, USA. Tobiason MD; School of Materials Science, Boise State University, Boise, Idaho, USA. Dickinson GD; School of Materials Science, Boise State University, Boise, Idaho, USA. HughesWL; School of Engineering, Kelowna, University of British Columbia, Kelowna, British Columbia, Canada. Zadegan R; Department of Nanoengineering, Joint School of Nanoscience and Nanoengineering, North Carolina A&T State University, Greensboro, NC, USA. . Andersen T; Department of Computer Science, Boise State University, Boise, Idaho, USA. .
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Źródło:
BMC bioinformatics [BMC Bioinformatics] 2023 Apr 21; Vol. 24 (1), pp. 160. Date of Electronic Publication: 2023 Apr 21.
Boron-Implanted Silicon Substrates for Physical Adsorption of DNA Origami.
Autorzy:
Takabayashi S; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Kotani S; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Flores-Estrada J; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Spears E; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Padilla JE; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Godwin LC; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Graugnard E; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. . Kuang W; Department of Electrical & Computer Engineering, Boise State University, Boise, ID 83725, USA. . Sills S; Micron Technology, Inc., 8000 South Federal Way, Boise, ID 83707-0006, USA. . HughesWL; Micron School of Materials Science & Engineering, Boise State University, Boise, ID 83725, USA. .
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