- Tytuł:
- Inductive Sintering of Silver Micro Particles for Bonding of Microelectronic Components.
- Autorzy:
- Temat:
-
INDUCTION heating
SINTERING
SEALING (Technology)
INDUCTION coils
HEAT of reaction
SILVER - Źródło:
- Electronics (2079-9292); Aug2023, Vol. 12 Issue 15, p3247, 24p
Czasopismo naukowe