- Tytuł:
- Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils.
- Autorzy:
- Temat:
-
INDUCTION heating
SEMICONDUCTOR wafer bondingALUMINUM nitride
MICROELECTRONIC packaging
FINITE element method
SHEAR strength
ALUMINUM composites
COPPER-tin alloys - Źródło:
- Micromachines; Aug2022, Vol. 13 Issue 8, p1307-1307, 24p
Czasopismo naukowe