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You search for a phrase ""Le Denmat, J. C."" according to the criterion: Author


Showing 1-19 from 19 results
Title :
300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications.
Authors :
Gras, R.
Gaillard, F.
Bouchu, D.
Farcy, A.
Petitprez, E.
Icard, B.
Le-Denmat, J. C.
Pain, L.
Bustos, J.
Haumesser, P. H.
Brun, P.
Imbert, G.
Clement, L.
Borowiak, C.
Rivoire, M.
Euvrard, C.
Arnal, V.
Olivier, S.
Moreau, S.
Mellier, M.
Show more
Source :
2008 International Interconnect Technology Conference; 2008, p196-198, 3p
Conference
    Showing 1-19 from 19 results

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