- Tytuł:
- High-Level Crosstalk Model in N-Coupled Through-Silicon Vias (TSVs)
- Autorzy:
- Temat:
-
integrated circuit reliability
SPICE
crosstalk
interconnect
through-silicon via
Electrical engineering. Electronics. Nuclear engineering
TK1-9971
Computer engineering. Computer hardware
TK7885-7895 - Źródło:
- Advances in Electrical and Computer Engineering, Vol 18, Iss 3, Pp 9-14 (2018)
- Opis pliku:
- electronic resource
- Relacje:
- https://doaj.org/toc/1582-7445; https://doaj.org/toc/1844-7600
- Dostęp URL:
- https://doaj.org/article/26817cf91c4e45b3b23082ae8a4c9d9f  Link otwiera się w nowym oknie
Czasopismo naukowe