- Tytuł :
- Low temperature transient liquid phase bonded Cu-Sn-Mo and Cu-Sn-Ag-Mo interconnects – A novel approach for hybrid metal baseplates
- Autorzy :
- Źródło :
- In 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ( ESREF 2018 ), Microelectronics Reliability September 2018 88-90:774-778
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Czasopismo naukowe